Building Chips in America Act of 2023
Official title: A bill to amend the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 to clarify the scope of a major Federal action under th… Show full official titleShow less
Official title: A bill to amend the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 to clarify the scope of a major Federal action under the National Environmental Policy Act of 1969 with respect to certain projects relating to the production of semiconductors, and for other purposes.
| Date | Chamber | What was voted on | Result | Yes–No | |
|---|---|---|---|---|---|
| Sep 23, 2024 | House · vote #440 | On Motion to Suspend the Rules and Pass | Passed | 257–125 | See who voted → |
Amendments propose changes to this bill. Members vote on amendments separately before the final bill vote. An agreed amendment becomes part of the bill; a failed amendment does not.
1 agreed to
| Amendment | Sponsor | Status |
|---|---|---|
| SAMDT 1,378 | Kelly, Mark | Agreed to |
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Became Public Law No: 118-105.
Building Chips in America Act of 2023
This bill modifies and limits the review of certain semiconductor (i.e., microchip) projects under the National Environmental Policy Act of 1969 (NEPA) and the National Historic Preservation Act (NHPA).
First, the bill exempts from NEPA and NHPA specified semiconductor projects that receive financial assistance under the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021, including semiconductor projects with (1) activities that commence by December 31, 2024; (2) federal financial assistance provided in the form of a loan or loan guarantee; or (3) federal financial assistance, excluding any loan or loan guarantee, that comprises no more than 10% of the total estimated cost of the project. Further, the bill exempts certain activities from NEPA relating to the construction, expansion, or modernization of semiconductor facilities by establishing several categorical exclusions.
Next, the bill allows the Department of Commerce to serve as the lead agency for the review of a semiconductor project that receives such financial assistance but is not exempted from review under NEPA.
In completing an environmental review under NEPA for semiconductor projects that receive such financial assistance, Commerce may rely on or adopt prior studies and decisions under certain circumstances.
- Engrossed in Senate Formatted Text PDF Formatted XML
- Enrolled Bill Formatted Text PDF Formatted XML
- Introduced in Senate Formatted Text PDF Formatted XML
- Public Law Formatted Text PDF United States Legislative Markup
- CHAMBER OF COMMERCE OF THE U.S.A.
- CHAMBER OF COMMERCE OF THE U.S.A.
- SOLVAY CHEMICALS INC.
- SOLVAY CHEMICALS INC.
- SOLVAY CHEMICALS INC.
- SOLVAY CHEMICALS INC.
Bodies those filers lobbied
- HOUSE OF REPRESENTATIVES
- SENATE
- Council on Environmental Quality (CEQ)
- Energy, Dept of
- Environmental Protection Agency (EPA)
- State, Dept of (DOS)
- Treasury, Dept of
- U.S. Trade Representative (USTR)
Cite this page
U.S. Congress. (2026). S. 2228: Building Chips in America Act of 2023. 118th Congress. Open America. https://openamerica.io/bill/118-S-2228/
"S. 2228: Building Chips in America Act of 2023." 118th Congress, 2026, Open America, https://openamerica.io/bill/118-S-2228/.
S. 2228, 118th Cong. (2026), https://openamerica.io/bill/118-S-2228/.
[S. 2228: Building Chips in America Act of 2023](https://openamerica.io/bill/118-S-2228/)